Korean
Wafer Bonding
Overview of attention for book
Table of Contents
-
Altmetric BadgeBook Overview
-
Altmetric BadgeChapter 1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
-
Altmetric BadgeChapter 2 Basics of Silicon-on-Insulator (SOI) Technology
-
Altmetric BadgeChapter 3 Silicon-on-insulator by the Smart Cut™ Process
-
Altmetric BadgeChapter 4 ELTRAN® Technology Based on Wafer Bonding and Porous Silicon
-
Altmetric BadgeChapter 5 Wafer Bonding for High-Performance Logic Applications
-
Altmetric BadgeChapter 6 Application of Bonded Wafers to the Fabrication of Electronic Devices
-
Altmetric BadgeChapter 7 Compound Semiconductor Heterostructures by Smart Cut™: SiC On Insulator, QUASIC™ Substrates, InP and GaAs Heterostructures on Silicon
-
Altmetric BadgeChapter 8 Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
-
Altmetric BadgeChapter 9 Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers
-
Altmetric BadgeChapter 10 High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits
-
Altmetric BadgeChapter 11 Layer Transfer by Bonding and Laser Lift-Off
-
Altmetric BadgeChapter 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing
-
Altmetric BadgeChapter 13 Wafer Bonding of Ferroelectric Materials
-
Altmetric BadgeChapter 14 Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications