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Chapter title |
High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits
|
---|---|
Chapter number | 10 |
Book title |
Wafer Bonding
|
Published by |
Springer, Berlin, Heidelberg, January 2004
|
DOI | 10.1007/978-3-662-10827-7_10 |
Book ISBNs |
978-3-64-205915-5, 978-3-66-210827-7
|
Authors |
E. D. Kyriakis-Bitzaros, G. Halkias, Kyriakis-Bitzaros, E. D., Halkias, G. |