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Mendeley readers
| Chapter title |
Basics of Silicon-on-Insulator (SOI) Technology
|
|---|---|
| Chapter number | 2 |
| Book title |
Wafer Bonding
|
| Published by |
Springer, Berlin, Heidelberg, January 2004
|
| DOI | 10.1007/978-3-662-10827-7_2 |
| Book ISBNs |
978-3-64-205915-5, 978-3-66-210827-7
|
| Authors |
J.-P. Colinge, Colinge, J.-P. |
Mendeley readers
The data shown below were compiled from readership statistics for 44 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| China | 2 | 5% |
| Iran, Islamic Republic of | 1 | 2% |
| United States | 1 | 2% |
| Malaysia | 1 | 2% |
| Unknown | 39 | 89% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 16 | 36% |
| Student > Master | 10 | 23% |
| Student > Bachelor | 4 | 9% |
| Researcher | 4 | 9% |
| Student > Doctoral Student | 2 | 5% |
| Other | 6 | 14% |
| Unknown | 2 | 5% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 28 | 64% |
| Physics and Astronomy | 6 | 14% |
| Materials Science | 4 | 9% |
| Economics, Econometrics and Finance | 1 | 2% |
| Agricultural and Biological Sciences | 1 | 2% |
| Other | 0 | 0% |
| Unknown | 4 | 9% |