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Chapter title |
Compound Semiconductor Heterostructures by Smart Cut™: SiC On Insulator, QUASIC™ Substrates, InP and GaAs Heterostructures on Silicon
|
---|---|
Chapter number | 7 |
Book title |
Wafer Bonding
|
Published by |
Springer, Berlin, Heidelberg, January 2004
|
DOI | 10.1007/978-3-662-10827-7_7 |
Book ISBNs |
978-3-64-205915-5, 978-3-66-210827-7
|
Authors |
L. Di Cioccio, E. Jalaguier, F. Letertre, Di Cioccio, L., Jalaguier, E., Letertre, F. |