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Mendeley readers
| Title |
Wafer Bonding
|
|---|---|
| Published by |
Springer Berlin Heidelberg, March 2013
|
| DOI | 10.1007/978-3-662-10827-7 |
| ISBNs |
978-3-64-205915-5, 978-3-66-210827-7
|
| Editors |
Alexe, Marin, Gösele, Ulrich |
Mendeley readers
The data shown below were compiled from readership statistics for 10 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 10 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Master | 1 | 10% |
| Unknown | 9 | 90% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 1 | 10% |
| Unknown | 9 | 90% |