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Wafer Bonding

Overview of attention for book
Cover of 'Wafer Bonding'

Table of Contents

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    Book Overview
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    Chapter 1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
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    Chapter 2 Basics of Silicon-on-Insulator (SOI) Technology
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    Chapter 3 Silicon-on-insulator by the Smart Cut™ Process
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    Chapter 4 ELTRAN® Technology Based on Wafer Bonding and Porous Silicon
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    Chapter 5 Wafer Bonding for High-Performance Logic Applications
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    Chapter 6 Application of Bonded Wafers to the Fabrication of Electronic Devices
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    Chapter 7 Compound Semiconductor Heterostructures by Smart Cut™: SiC On Insulator, QUASIC™ Substrates, InP and GaAs Heterostructures on Silicon
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    Chapter 8 Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
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    Chapter 9 Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers
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    Chapter 10 High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits
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    Chapter 11 Layer Transfer by Bonding and Laser Lift-Off
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    Chapter 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing
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    Chapter 13 Wafer Bonding of Ferroelectric Materials
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    Chapter 14 Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications
Attention for Chapter 8: Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
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Summary
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Chapter title
Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
Chapter number 8
Book title
Wafer Bonding
Published by
Springer, Berlin, Heidelberg, January 2004
DOI 10.1007/978-3-662-10827-7_8
Book ISBNs
978-3-64-205915-5, 978-3-66-210827-7
Authors

S. Noda, Noda, S.

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