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Mendeley readers
Chapter title |
Silicon-on-insulator by the Smart Cut™ Process
|
---|---|
Chapter number | 3 |
Book title |
Wafer Bonding
|
Published by |
Springer, Berlin, Heidelberg, January 2004
|
DOI | 10.1007/978-3-662-10827-7_3 |
Book ISBNs |
978-3-64-205915-5, 978-3-66-210827-7
|
Authors |
G. K. Celler, A. J. Auberton-Hervé, B. Aspar, C. Lagahe-Blanchard, C. Maleville, Celler, G. K., Auberton-Hervé, A. J., Aspar, B., Lagahe-Blanchard, C., Maleville, C. |
Mendeley readers
The data shown below were compiled from readership statistics for 2 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 2 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Student > Master | 1 | 50% |
Unknown | 1 | 50% |
Readers by discipline | Count | As % |
---|---|---|
Materials Science | 1 | 50% |
Unknown | 1 | 50% |