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Mendeley readers
Chapter title |
Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
|
---|---|
Chapter number | 1 |
Book title |
Wafer Bonding
|
Published by |
Springer, Berlin, Heidelberg, January 2004
|
DOI | 10.1007/978-3-662-10827-7_1 |
Book ISBNs |
978-3-64-205915-5, 978-3-66-210827-7
|
Authors |
J. Haisma, Haisma, J. |
Mendeley readers
The data shown below were compiled from readership statistics for 3 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 3 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Other | 1 | 33% |
Student > Master | 1 | 33% |
Unknown | 1 | 33% |
Readers by discipline | Count | As % |
---|---|---|
Chemistry | 1 | 33% |
Engineering | 1 | 33% |
Unknown | 1 | 33% |