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Mendeley readers
Chapter title |
A Prototype Wafer Processing TCAD Tool Composed of BMD Simulation Module, Metal Gettering and Thermal Stress/Slip Functions for Scaled Device Design Phase
|
---|---|
Chapter number | 32 |
Book title |
Simulation of Semiconductor Processes and Devices 2007
|
Published by |
Springer, Vienna, January 2007
|
DOI | 10.1007/978-3-211-72861-1_32 |
Book ISBNs |
978-3-21-172860-4, 978-3-21-172861-1
|
Authors |
T. Okada, A. Fathurahman, R. Takeda, H. Banba, H. Kubota, Y. Matsushita, M. Naito, S. Nakamura, Okada, T., Fathurahman, A., Takeda, R., Banba, H., Kubota, H., Matsushita, Y., Naito, M., Nakamura, S. |
Mendeley readers
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 1 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Researcher | 1 | 100% |
Readers by discipline | Count | As % |
---|---|---|
Mathematics | 1 | 100% |