Embedded Microfluidic Cooling in Aluminum Nitride HTCC Substrate for High-Power Radio Frequency Chip Array
Article in Journal of Thermal Science and Engineering Applications (June 2023)
The most recent citing publications are shown below. View all 28 publications that cite this research output on Dimensions.
Article in Journal of Thermal Science and Engineering Applications (June 2023)
Article in IEEE Transactions on Microwave Theory and Techniques (June 2023)
Article in IEEE Microwave and Wireless Technology Letters (June 2023)