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RF and Microwave Microelectronics Packaging

Overview of attention for book
Attention for Chapter 9: LTCC Substrates for RF/MW Application
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Citations

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Readers on

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5 Mendeley
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Chapter title
LTCC Substrates for RF/MW Application
Chapter number 9
Book title
RF and Microwave Microelectronics Packaging
Published by
Springer, Boston, MA, January 2010
DOI 10.1007/978-1-4419-0984-8_9
Book ISBNs
978-1-4419-0983-1, 978-1-4419-0984-8
Authors

Jian Yang, Ziliang Wang, Yang, Jian, Wang, Ziliang

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 5 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 5 100%

Demographic breakdown

Readers by professional status Count As %
Student > Master 2 40%
Student > Doctoral Student 1 20%
Student > Ph. D. Student 1 20%
Unknown 1 20%
Readers by discipline Count As %
Engineering 4 80%
Unknown 1 20%