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RF and Microwave Microelectronics Packaging

Overview of attention for book
Attention for Chapter 4: Millimeter-Wave Chip-on-Board Integration and Packaging
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Chapter title
Millimeter-Wave Chip-on-Board Integration and Packaging
Chapter number 4
Book title
RF and Microwave Microelectronics Packaging
Published by
Springer, Boston, MA, January 2010
DOI 10.1007/978-1-4419-0984-8_4
Book ISBNs
978-1-4419-0983-1, 978-1-4419-0984-8
Authors

Edward B. Stoneham, Stoneham, Edward B.