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| Chapter title |
Ceramic Systems in Package for RF and Microwave
|
|---|---|
| Chapter number | 7 |
| Book title |
RF and Microwave Microelectronics Packaging
|
| Published by |
Springer, Boston, MA, January 2010
|
| DOI | 10.1007/978-1-4419-0984-8_7 |
| Book ISBNs |
978-1-4419-0983-1, 978-1-4419-0984-8
|
| Authors |
Thomas Bartnitzek, William Gautier, Guangwen Qu, Shi Cheng, Afshin Ziaei, Bartnitzek, Thomas, Gautier, William, Qu, Guangwen, Cheng, Shi, Ziaei, Afshin |