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Mendeley readers
| Chapter title |
High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
|
|---|---|
| Chapter number | 10 |
| Book title |
RF and Microwave Microelectronics Packaging
|
| Published by |
Springer, Boston, MA, January 2010
|
| DOI | 10.1007/978-1-4419-0984-8_10 |
| Book ISBNs |
978-1-4419-0983-1, 978-1-4419-0984-8
|
| Authors |
Juan L. Sepulveda, Lee J. Vandermark, Sepulveda, Juan L., Vandermark, Lee J. |
Mendeley readers
The data shown below were compiled from readership statistics for 5 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 5 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Professor | 1 | 20% |
| Researcher | 1 | 20% |
| Student > Doctoral Student | 1 | 20% |
| Unknown | 2 | 40% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 2 | 40% |
| Physics and Astronomy | 1 | 20% |
| Unknown | 2 | 40% |