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RF and Microwave Microelectronics Packaging

Overview of attention for book
Cover of 'RF and Microwave Microelectronics Packaging'

Table of Contents

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    Book Overview
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    Chapter 1 Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies
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    Chapter 2 Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
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    Chapter 3 Polymeric Microelectromechanical Millimeter Wave Systems
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    Chapter 4 Millimeter-Wave Chip-on-Board Integration and Packaging
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    Chapter 5 Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
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    Chapter 6 RF/Microwave Substrate Packaging Roadmap for Portable Devices
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    Chapter 7 Ceramic Systems in Package for RF and Microwave
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    Chapter 8 Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
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    Chapter 9 LTCC Substrates for RF/MW Application
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    Chapter 10 High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
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    Chapter 11 High Performance Microelectronics Packaging Heat Sink Materials
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    Chapter 12 Technology Research on AlN 3D MCM
Attention for Chapter 10: High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
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