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RF and Microwave Microelectronics Packaging

Overview of attention for book
Attention for Chapter 6: RF/Microwave Substrate Packaging Roadmap for Portable Devices
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Citations

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3 Mendeley
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Chapter title
RF/Microwave Substrate Packaging Roadmap for Portable Devices
Chapter number 6
Book title
RF and Microwave Microelectronics Packaging
Published by
Springer, Boston, MA, January 2010
DOI 10.1007/978-1-4419-0984-8_6
Book ISBNs
978-1-4419-0983-1, 978-1-4419-0984-8
Authors

Mumtaz Bora, Bora, Mumtaz

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 3 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 3 100%

Demographic breakdown

Readers by professional status Count As %
Researcher 1 33%
Student > Postgraduate 1 33%
Unknown 1 33%
Readers by discipline Count As %
Materials Science 2 67%
Unknown 1 33%