↓ Skip to main content
What is this page? Embed badge

RF and Microwave Microelectronics Packaging

Overview of attention for book
Cover of 'RF and Microwave Microelectronics Packaging'

Table of Contents

  1. Altmetric Badge
    Book Overview
  2. Altmetric Badge
    Chapter 1 Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies
  3. Altmetric Badge
    Chapter 2 Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
  4. Altmetric Badge
    Chapter 3 Polymeric Microelectromechanical Millimeter Wave Systems
  5. Altmetric Badge
    Chapter 4 Millimeter-Wave Chip-on-Board Integration and Packaging
  6. Altmetric Badge
    Chapter 5 Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
  7. Altmetric Badge
    Chapter 6 RF/Microwave Substrate Packaging Roadmap for Portable Devices
  8. Altmetric Badge
    Chapter 7 Ceramic Systems in Package for RF and Microwave
  9. Altmetric Badge
    Chapter 8 Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
  10. Altmetric Badge
    Chapter 9 LTCC Substrates for RF/MW Application
  11. Altmetric Badge
    Chapter 10 High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
  12. Altmetric Badge
    Chapter 11 High Performance Microelectronics Packaging Heat Sink Materials
  13. Altmetric Badge
    Chapter 12 Technology Research on AlN 3D MCM
Attention for Chapter 6: RF/Microwave Substrate Packaging Roadmap for Portable Devices
Altmetric Badge

Citations

dimensions_citation
28 Dimensions

Readers on

mendeley
3 Mendeley
Summary Dimensions citations
So far, Dimensions has found 28 publications that cite this research output.

28

The most recent citing publications are shown below. View all 28 publications that cite this research output on Dimensions.

This page shows the most recent citations of this research output.

Click here to find out how to access more activity.

This page is provided by Altmetric.