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Mendeley readers
Chapter title |
Cu/Sn Solid–Liquid Interdiffusion Bonding
|
---|---|
Chapter number | 7 |
Book title |
Wafer Level 3-D ICs Process Technology
|
Published by |
Springer, Boston, MA, January 2008
|
DOI | 10.1007/978-0-387-76534-1_7 |
Book ISBNs |
978-0-387-76532-7, 978-0-387-76534-1
|
Authors |
A. Munding, H. Hübner, A. Kaiser, S. Penka, P. Benkart, E. Kohn, Munding, A., Hübner, H., Kaiser, A., Penka, S., Benkart, P., Kohn, E. |
Mendeley readers
The data shown below were compiled from readership statistics for 7 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 7 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Student > Master | 3 | 43% |
Student > Ph. D. Student | 2 | 29% |
Professor > Associate Professor | 1 | 14% |
Unknown | 1 | 14% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 5 | 71% |
Physics and Astronomy | 1 | 14% |
Unknown | 1 | 14% |