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Wafer Level 3-D ICs Process Technology

Overview of attention for book
Attention for Chapter 8: An SOI-Based 3D Circuit Integration Technology
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2 patents

Citations

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86 Dimensions

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3 Mendeley
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Chapter title
An SOI-Based 3D Circuit Integration Technology
Chapter number 8
Book title
Wafer Level 3-D ICs Process Technology
Published by
Springer, Boston, MA, January 2008
DOI 10.1007/978-0-387-76534-1_8
Book ISBNs
978-0-387-76532-7, 978-0-387-76534-1
Authors

James Burns, Brian Aull, Robert Berger, Nisha Checka, Chang-Lee Chen, Chenson Chen, Pascale Gouker, Craig Keast, Jeffrey Knecht, Antonio Soares, Vyshnavi Suntharalingam, Brian Tyrrell, Keith Warner, Bruce Wheeler, Peter Wyatt, Donna Yost, Burns, James, Aull, Brian, Berger, Robert, Checka, Nisha, Chen, Chang-Lee, Chen, Chenson, Gouker, Pascale, Keast, Craig, Knecht, Jeffrey, Soares, Antonio, Suntharalingam, Vyshnavi, Tyrrell, Brian, Warner, Keith, Wheeler, Bruce, Wyatt, Peter, Yost, Donna

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 3 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Germany 1 33%
Canada 1 33%
Unknown 1 33%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 2 67%
Professor 1 33%
Readers by discipline Count As %
Engineering 3 100%