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Mendeley readers
| Chapter title |
Circuit Architectures for 3D Integration
|
|---|---|
| Chapter number | 13 |
| Book title |
Wafer Level 3-D ICs Process Technology
|
| Published by |
Springer, Boston, MA, January 2008
|
| DOI | 10.1007/978-0-387-76534-1_13 |
| Book ISBNs |
978-0-387-76532-7, 978-0-387-76534-1
|
| Authors |
Nisha Checka, Checka, Nisha |
Mendeley readers
The data shown below were compiled from readership statistics for 4 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Germany | 1 | 25% |
| Canada | 1 | 25% |
| Unknown | 2 | 50% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Professor | 2 | 50% |
| Student > Ph. D. Student | 2 | 50% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 4 | 100% |