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Mendeley readers
| Chapter title |
Thermal Challenges of 3D ICs
|
|---|---|
| Chapter number | 14 |
| Book title |
Wafer Level 3-D ICs Process Technology
|
| Published by |
Springer, Boston, MA, January 2008
|
| DOI | 10.1007/978-0-387-76534-1_14 |
| Book ISBNs |
978-0-387-76532-7, 978-0-387-76534-1
|
| Authors |
Sheng-Chih Lin, Kaustav Banerjee, Lin, Sheng-Chih, Banerjee, Kaustav |
Mendeley readers
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Canada | 1 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 3 | 300% |
| Student > Master | 2 | 200% |
| Professor | 1 | 100% |
| Student > Doctoral Student | 1 | 100% |
| Researcher | 1 | 100% |
| Other | 0 | 0% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 6 | 600% |
| Materials Science | 1 | 100% |
| Design | 1 | 100% |