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Wafer Level 3-D ICs Process Technology

Overview of attention for book
Attention for Chapter 3: Stacked CMOS Technologies
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Citations

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3 Mendeley
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Chapter title
Stacked CMOS Technologies
Chapter number 3
Book title
Wafer Level 3-D ICs Process Technology
Published by
Springer, Boston, MA, January 2008
DOI 10.1007/978-0-387-76534-1_3
Book ISBNs
978-0-387-76532-7, 978-0-387-76534-1
Authors

Mansun Chan, Chan, Mansun

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 3 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Canada 1 33%
Unknown 2 67%

Demographic breakdown

Readers by professional status Count As %
Professor 1 33%
Student > Ph. D. Student 1 33%
Student > Master 1 33%
Readers by discipline Count As %
Engineering 3 100%