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Mendeley readers
| Chapter title |
Wafer-Bonding Technologies and Strategies for 3D ICs
|
|---|---|
| Chapter number | 4 |
| Book title |
Wafer Level 3-D ICs Process Technology
|
| Published by |
Springer, Boston, MA, January 2008
|
| DOI | 10.1007/978-0-387-76534-1_4 |
| Book ISBNs |
978-0-387-76532-7, 978-0-387-76534-1
|
| Authors |
Shari Farrens, Farrens, Shari |
Mendeley readers
The data shown below were compiled from readership statistics for 39 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Canada | 1 | 3% |
| Unknown | 38 | 97% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Master | 4 | 10% |
| Researcher | 3 | 8% |
| Student > Ph. D. Student | 2 | 5% |
| Student > Bachelor | 1 | 3% |
| Professor | 1 | 3% |
| Other | 1 | 3% |
| Unknown | 27 | 69% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 9 | 23% |
| Materials Science | 2 | 5% |
| Physics and Astronomy | 1 | 3% |
| Unknown | 27 | 69% |