Fan-Out Wafer-Level Packaging

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Cover of 'Fan-Out Wafer-Level Packaging'

Table of Contents

Attention for Chapter 1: Patent Issues of Fan-Out Wafer-Level Packaging

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So far, Dimensions has found 80 publications that cite this research output.

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Advancements in mechanical characterization techniques and environmental effects on bi-material interfaces in microelectronics: a literature review

Article in The Journal of Adhesion (May 2024)

Investigation of Wafer Warpage Evolution Baesd on Fan-Out Chip-first Process

Conference proceeding (April 2024)

Perspective on Plasma Etching in Advanced Packaging

Conference proceeding (March 2024)

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