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Mendeley readers
| Chapter title |
Flip Chip Technology Versus FOWLP
|
|---|---|
| Chapter number | 2 |
| Book title |
Fan-Out Wafer-Level Packaging
|
| Published by |
Springer, Singapore, January 2018
|
| DOI | 10.1007/978-981-10-8884-1_2 |
| Book ISBNs |
978-9-81-108883-4, 978-9-81-108884-1
|
| Authors |
John H. Lau, Lau, John H. |
Mendeley readers
The data shown below were compiled from readership statistics for 9 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 9 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Master | 2 | 22% |
| Lecturer > Senior Lecturer | 1 | 11% |
| Student > Ph. D. Student | 1 | 11% |
| Unspecified | 1 | 11% |
| Student > Doctoral Student | 1 | 11% |
| Other | 1 | 11% |
| Unknown | 2 | 22% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 3 | 33% |
| Materials Science | 2 | 22% |
| Nursing and Health Professions | 1 | 11% |
| Chemistry | 1 | 11% |
| Unspecified | 1 | 11% |
| Other | 0 | 0% |
| Unknown | 1 | 11% |