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Mendeley readers
| Chapter title |
3D Integration
|
|---|---|
| Chapter number | 10 |
| Book title |
Fan-Out Wafer-Level Packaging
|
| Published by |
Springer, Singapore, January 2018
|
| DOI | 10.1007/978-981-10-8884-1_10 |
| Book ISBNs |
978-9-81-108883-4, 978-9-81-108884-1
|
| Authors |
John H. Lau, Lau, John H. |
Mendeley readers
The data shown below were compiled from readership statistics for 63 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Serbia | 1 | 2% |
| Greece | 1 | 2% |
| France | 1 | 2% |
| Unknown | 60 | 95% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Researcher | 14 | 22% |
| Student > Ph. D. Student | 13 | 21% |
| Student > Bachelor | 7 | 11% |
| Student > Master | 6 | 10% |
| Professor > Associate Professor | 5 | 8% |
| Other | 9 | 14% |
| Unknown | 9 | 14% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 24 | 38% |
| Materials Science | 7 | 11% |
| Chemistry | 5 | 8% |
| Energy | 3 | 5% |
| Agricultural and Biological Sciences | 3 | 5% |
| Other | 9 | 14% |
| Unknown | 12 | 19% |