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X Demographics
Mendeley readers
| Title |
Fan-Out Wafer-Level Packaging
|
|---|---|
| Published by |
Springer Singapore, August 2018
|
| DOI | 10.1007/978-981-10-8884-1 |
| ISBNs |
978-9-81-108883-4, 978-9-81-108884-1
|
| Authors |
John H. Lau, Lau, John H. |
X Demographics
The data shown below were collected from the profile of 1 X user who shared this research output. Click here to find out more about how the information was compiled.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 1 | 100% |
Demographic breakdown
| Type | Count | As % |
|---|---|---|
| Scientists | 1 | 100% |
Mendeley readers
The data shown below were compiled from readership statistics for 61 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 61 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 18 | 30% |
| Researcher | 10 | 16% |
| Student > Master | 8 | 13% |
| Other | 5 | 8% |
| Student > Bachelor | 1 | 2% |
| Other | 3 | 5% |
| Unknown | 16 | 26% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 24 | 39% |
| Materials Science | 10 | 16% |
| Computer Science | 2 | 3% |
| Chemistry | 2 | 3% |
| Physics and Astronomy | 2 | 3% |
| Other | 3 | 5% |
| Unknown | 18 | 30% |