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Mendeley readers
| Chapter title |
FOWLP: Chip-First and Die Face-Down
|
|---|---|
| Chapter number | 5 |
| Book title |
Fan-Out Wafer-Level Packaging
|
| Published by |
Springer, Singapore, January 2018
|
| DOI | 10.1007/978-981-10-8884-1_5 |
| Book ISBNs |
978-9-81-108883-4, 978-9-81-108884-1
|
| Authors |
John H. Lau, Lau, John H. |
Mendeley readers
The data shown below were compiled from readership statistics for 5 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 5 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 2 | 40% |
| Researcher | 1 | 20% |
| Student > Master | 1 | 20% |
| Unknown | 1 | 20% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 2 | 40% |
| Chemistry | 1 | 20% |
| Engineering | 1 | 20% |
| Unknown | 1 | 20% |