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Copper Interconnect Technology

Overview of attention for book
Cover of 'Copper Interconnect Technology'

Table of Contents

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    Book Overview
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    Chapter 1 Introduction
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    Chapter 2 Dielectric Materials
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    Chapter 3 Diffusion and Barrier Layers
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    Chapter 4 Pattern Generation
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    Chapter 5 Deposition Technologies of Materials for Cu-Interconnects
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    Chapter 6 The Copper Damascene Process and Chemical Mechanical Polishing
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    Chapter 7 Conduction and Electromigration
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    Chapter 8 Routing and Reliability
Attention for Chapter 6: The Copper Damascene Process and Chemical Mechanical Polishing
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