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Copper Interconnect Technology

Overview of attention for book
Attention for Chapter 2: Dielectric Materials
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Mentioned by

patent
7 patents

Readers on

mendeley
33 Mendeley
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Chapter title
Dielectric Materials
Chapter number 2
Book title
Copper Interconnect Technology
Published by
Springer, New York, NY, January 2009
DOI 10.1007/978-1-4419-0076-0_2
Book ISBNs
978-1-4419-0075-3, 978-1-4419-0076-0
Authors

Tapan Gupta, Gupta, Tapan

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 33 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Germany 1 3%
Romania 1 3%
Unknown 31 94%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 8 24%
Student > Master 6 18%
Researcher 4 12%
Student > Bachelor 2 6%
Lecturer 2 6%
Other 3 9%
Unknown 8 24%
Readers by discipline Count As %
Engineering 8 24%
Materials Science 8 24%
Physics and Astronomy 5 15%
Computer Science 1 3%
Unknown 11 33%