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Mendeley readers
| Chapter title |
Deposition Technologies of Materials for Cu-Interconnects
|
|---|---|
| Chapter number | 5 |
| Book title |
Copper Interconnect Technology
|
| Published by |
Springer, New York, NY, January 2009
|
| DOI | 10.1007/978-1-4419-0076-0_5 |
| Book ISBNs |
978-1-4419-0075-3, 978-1-4419-0076-0
|
| Authors |
Tapan Gupta |
Mendeley readers
The data shown below were compiled from readership statistics for 3 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 3 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 1 | 33% |
| Researcher | 1 | 33% |
| Unknown | 1 | 33% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 1 | 33% |
| Engineering | 1 | 33% |
| Unknown | 1 | 33% |