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Copper Interconnect Technology

Overview of attention for book
Overall attention for this book and its chapters
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Mentioned by

patent
7 patents
wikipedia
1 Wikipedia page

Citations

dimensions_citation
127 Dimensions

Readers on

mendeley
315 Mendeley
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Title
Copper Interconnect Technology
Published by
Springer, New York, NY, January 2010
DOI 10.1007/978-1-4419-0076-0
ISBNs
978-1-4419-0075-3, 978-1-4419-0076-0
Authors

Tapan Gupta, Gupta, Tapan

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 315 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
United States 3 <1%
United Kingdom 2 <1%
Belgium 2 <1%
Ireland 1 <1%
Hungary 1 <1%
Malaysia 1 <1%
Unknown 305 97%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 107 34%
Student > Master 56 18%
Researcher 36 11%
Student > Bachelor 31 10%
Student > Doctoral Student 20 6%
Other 30 10%
Unknown 35 11%
Readers by discipline Count As %
Engineering 109 35%
Materials Science 61 19%
Physics and Astronomy 40 13%
Chemistry 39 12%
Chemical Engineering 4 1%
Other 15 5%
Unknown 47 15%