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Materials for Advanced Packaging

Overview of attention for book
Cover of 'Materials for Advanced Packaging'

Table of Contents

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    Book Overview
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    Chapter 1 3D Integration Technologies – An Overview
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    Chapter 2 Advanced Bonding/Joining Techniques
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    Chapter 3 Advanced Chip-to-Substrate Connections
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    Chapter 4 Advanced Wire Bonding Technology: Materials, Methods, and Testing
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    Chapter 5 Lead-Free Soldering
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    Chapter 6 Thin Die Production
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    Chapter 7 Advanced Substrates: A Materials and Processing Perspective
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    Chapter 8 Advanced Print Circuit Board Materials
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    Chapter 9 Flip-Chip Underfill: Materials, Process and Reliability
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    Chapter 10 Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
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    Chapter 11 Electrically Conductive Adhesives (ECAs)
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    Chapter 12 Die Attach Adhesives and Films
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    Chapter 13 Thermal Interface Materials
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    Chapter 14 Embedded Passives
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    Chapter 15 Nanomaterials and Nanopackaging
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    Chapter 16 Wafer Level Chip Scale Packaging
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    Chapter 17 Microelectromechanical Systems and Packaging
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    Chapter 18 LED and Optical Device Packaging and Materials
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    Chapter 19 Digital Health and Bio-Medical Packaging
Attention for Chapter 10: Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
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