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Mendeley readers
| Chapter title |
Lead-Free Soldering
|
|---|---|
| Chapter number | 5 |
| Book title |
Materials for Advanced Packaging
|
| Published by |
Springer, Boston, MA, January 2009
|
| DOI | 10.1007/978-0-387-78219-5_5 |
| Book ISBNs |
978-0-387-78218-8, 978-0-387-78219-5
|
| Authors |
Ning Cheng Lee, Lee, Ning Cheng |
Mendeley readers
The data shown below were compiled from readership statistics for 6 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 6 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 1 | 17% |
| Student > Bachelor | 1 | 17% |
| Student > Postgraduate | 1 | 17% |
| Other | 1 | 17% |
| Unknown | 2 | 33% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 2 | 33% |
| Environmental Science | 1 | 17% |
| Engineering | 1 | 17% |
| Unknown | 2 | 33% |