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Mendeley readers
| Chapter title |
Flip-Chip Underfill: Materials, Process and Reliability
|
|---|---|
| Chapter number | 9 |
| Book title |
Materials for Advanced Packaging
|
| Published by |
Springer, Boston, MA, January 2009
|
| DOI | 10.1007/978-0-387-78219-5_9 |
| Book ISBNs |
978-0-387-78218-8, 978-0-387-78219-5
|
| Authors |
Zhuqing Zhang, C. P. Wong, Zhang, Zhuqing, Wong, C. P. |
Mendeley readers
The data shown below were compiled from readership statistics for 21 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 21 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Bachelor | 6 | 29% |
| Student > Ph. D. Student | 5 | 24% |
| Student > Master | 2 | 10% |
| Student > Postgraduate | 2 | 10% |
| Researcher | 1 | 5% |
| Other | 1 | 5% |
| Unknown | 4 | 19% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 9 | 43% |
| Materials Science | 5 | 24% |
| Business, Management and Accounting | 1 | 5% |
| Arts and Humanities | 1 | 5% |
| Chemistry | 1 | 5% |
| Other | 0 | 0% |
| Unknown | 4 | 19% |