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Materials for Advanced Packaging

Overview of attention for book
Attention for Chapter 1: 3D Integration Technologies – An Overview
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Readers on

mendeley
14 Mendeley
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Chapter title
3D Integration Technologies – An Overview
Chapter number 1
Book title
Materials for Advanced Packaging
Published by
Springer, Boston, MA, January 2009
DOI 10.1007/978-0-387-78219-5_1
Book ISBNs
978-0-387-78218-8, 978-0-387-78219-5
Authors

Rajen Chanchani, Chanchani, Rajen

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 14 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
China 1 7%
Unknown 13 93%

Demographic breakdown

Readers by professional status Count As %
Student > Bachelor 2 14%
Student > Ph. D. Student 2 14%
Unspecified 1 7%
Student > Doctoral Student 1 7%
Student > Master 1 7%
Other 2 14%
Unknown 5 36%
Readers by discipline Count As %
Engineering 5 36%
Computer Science 2 14%
Unspecified 1 7%
Unknown 6 43%