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Mendeley readers
| Chapter title |
Advanced Bonding/Joining Techniques
|
|---|---|
| Chapter number | 2 |
| Book title |
Materials for Advanced Packaging
|
| Published by |
Springer, Boston, MA, January 2009
|
| DOI | 10.1007/978-0-387-78219-5_2 |
| Book ISBNs |
978-0-387-78218-8, 978-0-387-78219-5
|
| Authors |
Chin C. Lee, Pin J. Wang, Jong S. Kim, Lee, Chin C., Wang, Pin J., Kim, Jong S. |
Mendeley readers
The data shown below were compiled from readership statistics for 2 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 2 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 1 | 50% |
| Student > Doctoral Student | 1 | 50% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 1 | 50% |
| Engineering | 1 | 50% |