RF and Microwave Microelectronics Packaging II
Springer International Publishing
Title |
RF and Microwave Microelectronics Packaging II
|
---|---|
Published by |
Springer International Publishing, January 2017
|
DOI | 10.1007/978-3-319-51697-4 |
ISBNs |
978-3-31-951697-4, 978-3-31-951696-7
|
Editors |
Ken Kuang, Rick Sturdivant |
Country | Count | As % |
---|---|---|
Unknown | 1 | 100% |
Type | Count | As % |
---|---|---|
Members of the public | 1 | 100% |
Country | Count | As % |
---|---|---|
United States | 1 | 2% |
Unknown | 60 | 98% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 17 | 28% |
Student > Master | 8 | 13% |
Student > Bachelor | 4 | 7% |
Researcher | 4 | 7% |
Student > Doctoral Student | 3 | 5% |
Other | 8 | 13% |
Unknown | 17 | 28% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 25 | 41% |
Physics and Astronomy | 7 | 11% |
Materials Science | 7 | 11% |
Chemistry | 2 | 3% |
Agricultural and Biological Sciences | 1 | 2% |
Other | 1 | 2% |
Unknown | 18 | 30% |