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RF and Microwave Microelectronics Packaging II

Overview of attention for book
Overall attention for this book and its chapters
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1 X user

Citations

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Readers on

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59 Mendeley
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Title
RF and Microwave Microelectronics Packaging II
Published by
Springer International Publishing, January 2017
DOI 10.1007/978-3-319-51697-4
ISBNs
978-3-31-951697-4, 978-3-31-951696-7
Editors

Ken Kuang, Rick Sturdivant

X Demographics

X Demographics

The data shown below were collected from the profile of 1 X user who shared this research output. Click here to find out more about how the information was compiled.
Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 59 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
United States 1 2%
Unknown 58 98%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 17 29%
Student > Master 8 14%
Student > Bachelor 4 7%
Researcher 4 7%
Student > Doctoral Student 3 5%
Other 8 14%
Unknown 15 25%
Readers by discipline Count As %
Engineering 25 42%
Physics and Astronomy 7 12%
Materials Science 7 12%
Chemistry 2 3%
Agricultural and Biological Sciences 1 2%
Other 1 2%
Unknown 16 27%