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| Chapter title |
Packaging of Transmit/Receive Modules
|
|---|---|
| Chapter number | 2 |
| Book title |
RF and Microwave Microelectronics Packaging II
|
| Published by |
Springer, Cham, January 2017
|
| DOI | 10.1007/978-3-319-51697-4_2 |
| Book ISBNs |
978-3-31-951696-7, 978-3-31-951697-4
|
| Authors |
Rick Sturdivant, Sturdivant, Rick |