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RF and Microwave Microelectronics Packaging II

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Cover of 'RF and Microwave Microelectronics Packaging II'

Table of Contents

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    Book Overview
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    Chapter 1 Introduction to Radio Frequency and Microwave Microelectronic Packaging
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    Chapter 2 Packaging of Transmit/Receive Modules
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    Chapter 3 3D Transitions and Connections
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    Chapter 4 Electromagnetic Shielding for RF and Microwave Packages
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    Chapter 5 Design of C-Band Interdigital Filter and Compact C-Band Hairpin Bandpass Film Filter on Thin Film Substrate
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    Chapter 6 Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package
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    Chapter 7 Chip Size Packaging (CSP) for RF MEMS Devices
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    Chapter 8 The Challenge in Packaging and Assembling the Advanced Power Amplifiers
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    Chapter 9 High Thermal Conductivity Materials: Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond
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    Chapter 10 Advancement in High Thermal Conductive Graphite for Microelectronic Packaging
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    Chapter 11 Carbon Nanotubes and Graphene for Microwave/RF Electronics Packaging
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    Chapter 12 Erratum to: Chip Size Packaging (CSP) for RF MEMS Devices
Attention for Chapter 2: Packaging of Transmit/Receive Modules
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