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RF and Microwave Microelectronics Packaging II

Overview of attention for book
Attention for Chapter 3: 3D Transitions and Connections
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Chapter title
3D Transitions and Connections
Chapter number 3
Book title
RF and Microwave Microelectronics Packaging II
Published by
Springer, Cham, January 2017
DOI 10.1007/978-3-319-51697-4_3
Book ISBNs
978-3-31-951696-7, 978-3-31-951697-4
Authors

Rick Sturdivant, Sturdivant, Rick

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 1 100%

Demographic breakdown

Readers by professional status Count As %
Professor > Associate Professor 1 100%
Readers by discipline Count As %
Earth and Planetary Sciences 1 100%