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| Chapter title |
Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package
|
|---|---|
| Chapter number | 6 |
| Book title |
RF and Microwave Microelectronics Packaging II
|
| Published by |
Springer, Cham, January 2017
|
| DOI | 10.1007/978-3-319-51697-4_6 |
| Book ISBNs |
978-3-31-951696-7, 978-3-31-951697-4
|
| Authors |
Pang Xueman, Xueman, Pang |