You are seeing a free-to-access but limited selection of the activity Altmetric has collected about this research output. Click here to find out more.
Fracture Analysis on Popcorning of Plastic Packages During Solder Reflow
Fracture of Nano and Engineering Materials and Structures
Springer Netherlands, November 2015
S. W. R. Lee, D. C. Y. Lau
E. E. Gdoutos