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| Chapter title |
Fracture Analysis on Popcorning of Plastic Packages During Solder Reflow
|
|---|---|
| Chapter number | 371 |
| Book title |
Fracture of Nano and Engineering Materials and Structures
|
| Published by |
Springer Netherlands, November 2015
|
| DOI | 10.1007/1-4020-4972-2_371 |
| Book ISBNs |
978-1-4020-4971-2, 978-1-4020-4972-9
|
| Authors |
S. W. R. Lee, D. C. Y. Lau |
| Editors |
E. E. Gdoutos |
Twitter Demographics
The data shown below were collected from the profile of 1 tweeter who shared this research output. Click here to find out more about how the information was compiled.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 1 | 100% |
Demographic breakdown
| Type | Count | As % |
|---|---|---|
| Members of the public | 1 | 100% |