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Creep Rupture of a Lead-Free Sn-Ag-Cu Solder
Fracture of Nano and Engineering Materials and Structures
Springer Netherlands, January 2006
C. -K. Lin, D. -Y. Chu
E. E. Gdoutos
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
|Readers by professional status||Count||As %|
|Student > Ph. D. Student||1||100%|
|Readers by discipline||Count||As %|