Materials for Advanced Packaging
Springer Science & Business Media
Chapter title |
Thermal Interface Materials
|
---|---|
Chapter number | 13 |
Book title |
Materials for Advanced Packaging
|
Published by |
Springer, Boston, MA, January 2009
|
DOI | 10.1007/978-0-387-78219-5_13 |
Book ISBNs |
978-0-387-78218-8, 978-0-387-78219-5
|
Authors |
Ravi Prasher, Chia-Pin Chiu, Prasher, Ravi, Chiu, Chia-Pin |
Country | Count | As % |
---|---|---|
United States | 1 | 6% |
Switzerland | 1 | 6% |
Unknown | 14 | 88% |
Readers by professional status | Count | As % |
---|---|---|
Researcher | 4 | 25% |
Student > Master | 3 | 19% |
Professor | 2 | 13% |
Student > Doctoral Student | 1 | 6% |
Student > Ph. D. Student | 1 | 6% |
Other | 3 | 19% |
Unknown | 2 | 13% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 10 | 63% |
Chemistry | 1 | 6% |
Energy | 1 | 6% |
Materials Science | 1 | 6% |
Design | 1 | 6% |
Other | 0 | 0% |
Unknown | 2 | 13% |