Materials for Advanced Packaging
Springer Science & Business Media
Chapter title |
Wafer Level Chip Scale Packaging
|
---|---|
Chapter number | 16 |
Book title |
Materials for Advanced Packaging
|
Published by |
Springer, Boston, MA, January 2009
|
DOI | 10.1007/978-0-387-78219-5_16 |
Book ISBNs |
978-0-387-78218-8, 978-0-387-78219-5
|
Authors |
Michael Töpper, Töpper, Michael |
Country | Count | As % |
---|---|---|
Unknown | 2 | 100% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 1 | 50% |
Student > Bachelor | 1 | 50% |
Readers by discipline | Count | As % |
---|---|---|
Computer Science | 1 | 50% |
Materials Science | 1 | 50% |