Materials for Advanced Packaging
Springer Science & Business Media
Chapter title |
Advanced Bonding/Joining Techniques
|
---|---|
Chapter number | 2 |
Book title |
Materials for Advanced Packaging
|
Published by |
Springer, Boston, MA, January 2009
|
DOI | 10.1007/978-0-387-78219-5_2 |
Book ISBNs |
978-0-387-78218-8, 978-0-387-78219-5
|
Authors |
Chin C. Lee, Pin J. Wang, Jong S. Kim, Lee, Chin C., Wang, Pin J., Kim, Jong S. |
Country | Count | As % |
---|---|---|
Unknown | 2 | 100% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 1 | 50% |
Student > Doctoral Student | 1 | 50% |
Readers by discipline | Count | As % |
---|---|---|
Materials Science | 1 | 50% |
Engineering | 1 | 50% |