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| Chapter title |
Wafer-Level Packaging TSV/Stack Die for Integration of Analog and Power Solution
|
|---|---|
| Chapter number | 6 |
| Book title |
Wafer-Level Chip-Scale Packaging
|
| Published by |
Springer, New York, NY, January 2015
|
| DOI | 10.1007/978-1-4939-1556-9_6 |
| Book ISBNs |
978-1-4939-1555-2, 978-1-4939-1556-9
|
| Authors |
Shichun Qu, Yong Liu, Qu, Shichun, Liu, Yong |