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Mendeley readers
| Chapter title |
Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging
|
|---|---|
| Chapter number | 1 |
| Book title |
Wafer-Level Chip-Scale Packaging
|
| Published by |
Springer, New York, NY, January 2015
|
| DOI | 10.1007/978-1-4939-1556-9_1 |
| Book ISBNs |
978-1-4939-1555-2, 978-1-4939-1556-9
|
| Authors |
Shichun Qu, Yong Liu, Qu, Shichun, Liu, Yong |
Mendeley readers
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 1 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 1 | 100% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 1 | 100% |